Sr Staff Packaging Product Engineer

Job Description

This senior technical contributor role will design, develop and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost and mass production robustness by collaborating with multiple departments (Design, Assembly, Test, Reliability Engineering, Quality, Sales and Marketing Team) and suppliers/OSAT’s around the world.

Job description

• Responsible for packaging design and technology development on advanced high power discrete, muti-chip, stacked and module packages.
• Responsible for defining package design rules, process flow and material set for new products including automotive power packages.
• Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions.
• Define BOM, assembly process development, assembly specification and qualification per standard requirements.
• Run process DOE’s to define optimum process windows and material characteristics on existing assembly processes and for new package development.
• Resolve package reliability, assembly issues and improving existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints.
• Collaborate with device design / product engineering teams and external high volume packaging vendors to achieve qualification target and ensure flawless time to market execution.
• Define and drive reliability testing and qualifications plans together with reliability engineers that meet Jedec/AEC and automotive quality standards of new power packages.
• Technical project management on key core technology projects includes managing timeline, material readiness, manufacturability and quality and timely reporting of progress.
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production.
• Collaborate with assembly engineering sustaining team to resolve technical issues, improving the yield, cost, cycle time and drive continuous improvement initiatives.
• Collaborate with cross functional teams to help develop a packaging roadmap aligned with the company’s product strategy and revenue targets.

Qualifications

• BS Degree in Electrical Engineering, Mechanical Engineering and Material Science
• Minimum experience 13 years in semiconductor packaging technology with hands-on design for manufacturability (Process Development & Package Development Engineer).
• Excellent people & leadership skills and experience in dealing with and managing OSATs.
• Substantial experience in Power discrete products with multi die & stacked die configuration, Ag sintered die bonding, Al, Cu/PCC bonding, Cu clip, flip chip LGA and QFN technologies and low stress vacuum molding.
• Can perform actual hands-on process capability analysis & risk prediction, design of experiments, variability charting, analysis of variance/means comparison/T-tests using SAS.JMP or mini tab software.
• Experience with latest material technologies: Sapphire substrate sawing, conductive & nonconductive high thermal die attach film, Ag sintered epoxies, clip bonding, ribbon wire bonding, high CTI, high thermal, high Tg, low stress fine filler molding compounds.
• Experience leading a project (program management).

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’

At Renesas, you can:

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.
• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Let’s Shape the Future together.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.