The Manufacturing Test–Product Engineer provides manufacturing test engineering support for Final Test operations to ensure product quality, manufacturing readiness, and cost‑effective high‑volume production. Collaborates with BU Product Engineers, Assembly Process Engineers, Quality Engg and Manufacturing operations in all aspects of Final Test Product and Test engineering areas for assigned products, including support of new product Safe Launch, technology ramps, and quality improvement initiatives to meet business, quality, and operational objectives.
•Provide technical ownership of Test manufacturing processes from product qualification through high‑volume production on assigned products or packages. •Support new product transfers, technology ramps, platform migrations of released solutions, process qualifications throughout manufacturing requiring Final Test characterization. •Manage, execute and sustain quality containment and firewall programs. •Define, implement, and sustain Test process flows, limits, guardbands, and control plans. •Lead Test yield improvement, defect reduction, and root‑cause analysis for production issues and excursions. •Drive quality and cost improvement initiatives with cross‑functional teams. •Provide timely technical support to manufacturing operations. •Develop and maintain technical documentation and best practices. •Owns Hold lots analysis, disposition and improvement of assigned products •Owns test program buyoff to ensure TP changes are vetted and validated to conform to required quality requirements for a robust TP program for manufacturing. •Education Bachelor’s degree or higher in Electrical Engineering, Electronics Engineering, Computer Engineering, Manufacturing Engineering, or Applied Physics •Experience 3; years of semiconductor manufacturing, test, or product engineering experience preferred. Strong candidates with good foundation in electronics, programming and problem solving are welcome to apply. Skills and Knowledge Requirement oTechnical Expertise & Consulting: •Strong understanding of semiconductor Test manufacturing fundamentals, common semiconductor device operation and characteristics. •Knowledge of test coverage, guard banding, limits optimization, and characterization concepts •Experience with failure analysis processes and yield data interpretation •Familiarity with SPC, control plans, and quality systems in a manufacturing environment. •Moderate programming/scripting skills to modify test programs and flows, debug test failures and false rejects, develop analysis scripts and automation tools. Collaborate with TD or BU for deeper code changes. oProblem Analysis: •Proficiency in structured problem-solving methodologies (., 8D, DMAIC, root cause analysis) •Ability to analyze large datasets and translate findings into actionable improvements •Strong troubleshooting skills in fast paced manufacturing environmentsTest Product Engineer (FT NPI) • Lapu-Lapu City, Philippines, Philippines
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