FC-BGA Engineer

FC-BGA Engineer

Process Engineering | Development | Product Design | Process Integration

[About LG Innotek]

LG Innotek is one of South Korea's leading advanced materials and components manufacturers and a core affiliate of LG Group.

Through its Package Solution Business, LG Innotek develops advanced semiconductor substrates including FC-BGA, FC-CSP, RF-SiP and AiP technologies.

Driven by rapid growth in AI, HPC, Server, CPU and GPU markets, LG Innotek is expanding its next-generation FC-BGA business and investing in advanced substrate technologies, manufacturing automation and future packaging platforms including Glass Core solutions.

For more information: https://www.lginnotek.com/company/intro.lgit?locale=en

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[Open Position]

① Integration Engineer

• Lead New Product Introduction (NPI) programs
• Manage product transition from development to mass production
• Coordinate Development, Manufacturing, Quality and Reliability teams
• Establish process windows and manufacturing readiness plans
• Lead NPI qualification and production transfer activities
• Drive yield improvement and reliability qualification
• Resolve cross-functional process integration challenges
• Lead production ramp-up and manufacturing stabilization

② Process Engineering Engineer

• Develop, optimize and stabilize FC-BGA manufacturing processes
• Lead process improvement activities in : ABF Lamination, Circuit Formation, Mechanical Drill / Laser Drill, Desmear, Chemical Copper Plating, Electro Copper Plating
• Yield improvement and defect reduction
• Root cause analysis and corrective actions
• Manufacturing readiness and production ramp-up
• Customer audits and process qualification support
• AOI, AVI and Electrical Test process optimization

③ Development Engineer

• Develop next-generation FC-BGA technologies
• Lead new material and new process development
• Develop advanced technologies including: Fine Pattern, Small Via, ETS, SAP / MSAP, Lithography, Copper Plating, Surface Finish
• Reliability evaluation and qualification
• Failure analysis and technology validation
• Customer technical engagement and development support

④ Product Design Engineer

• Package substrate layout design and CAM engineering
• FC-BGA substrate design and optimization
• Product specification review and design validation
• Design rule development and optimization
• CAM engineering and manufacturing data preparation
• Tooling and panel design
• Design automation development and programming
• Manufacturing process and design integration

[Qualifications]

■ Required

• Bachelor's degree or above in Materials Science, Chemical Engineering, Electrical Engineering, Electronics Engineering, Mechanical Engineering or other related disciplines
• Minimum 4 years of direct experience in FC-BGA development, manufacturing, product design, process engineering or process integration

■ Preferred

• New production line setup, factory startup or manufacturing ramp-up experienc

[Location] : Gumi, South Korea

* Relocation, visa sponsorship and temporary housing support will be provided

# LG # LG Innotek # FC-BGA # FCBGA # Advanced Packaging # CSP # Package # Substrate # ABF Substrate # Process Engineering # Process Integration # Product Development # Product Design # NPI # AI Server # HPC # CPU # GPU # Manufacturing # Ramp-Up # Advanced Packaging